2017
Conference Paper
Title

Four-Channel 784 Gbit/s Transmitter Module Enabled by Photonic Wire Bonding and Silicon-Organic Hybrid Modulators

Abstract
We demonstrate a four-channel hybrid multi-chip module comprising InP lasers, silicon-organic hybrid (SOH) modulators, and single-mode fibers, all connected via photonic wire bonds. We transmit 56 GBd QPSK and 16QAM signals at a total data rate of 784 Gbit/s over 75 km.
Author(s)
Billah, M.R.
Kemal, J.N.
Marin-Palomo, P.
Blaicher, M.
Kutuvantavida, Y.
Kieninger, C.
Zwickel, H.
Dietrich, P.-I.
Wolf, S.
Hoose, T.
Xu, Y.
Troppenz, U.
Moehrle, M.
Randel, S.
Freude, W.
Koos, C.
Mainwork
Conference
Open Access
DOI
Additional link
Language
English