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  4. High-efficiency, high-breakdown AlGaN/GaN HEMTs with lifetimes beyond 20 years
 
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2008
Conference Paper
Title

High-efficiency, high-breakdown AlGaN/GaN HEMTs with lifetimes beyond 20 years

Abstract
AlGaN/GaN HEMTs on various substrates have raised a lot of interest for the application in future high-efficiency base station systems for next generation mobile communication, currently dominated by LDMOS technology. Using GaN technology in a transmitter, infrastructure equipment manufacturers will benefit from major improvements in system performance and flexibility. AlGaN/GaN HEMTs enable innovative circuit concepts and transceiver architecture (e.g. switch mode power amplifiers, SMPA) with high efficiency and high operating bias. However, besides performance it will be crucial to match or even exceed the device reliability of other technologies in order to be competitive. To meet this goal, it is vital to optimize epitaxial growth as well as process technology.
Author(s)
Waltereit, Patrick  
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Bronner, Wolfgang  
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Quay, Rüdiger  orcid-logo
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Dammann, Michael  
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Müller, Stefan
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Mikulla, Michael  
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Rijs, F. van
Rödle, T.
Riepe, K.
Mainwork
Device Research Conference. 66th DRC 2008  
Conference
Device Research Conference (DRC) 2008  
DOI
10.1109/DRC.2008.4800770
Language
English
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
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