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Interface investigations and modeling of heavy wire bonds on power semiconductors for end of life determination
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2008
Conference Paper
Title
Interface investigations and modeling of heavy wire bonds on power semiconductors for end of life determination
Author(s)
Lang, K.-D.
Goehre, J.
Schneider-Ramelow, M.
Mainwork
EPTC 2008, 10th Electronics Packaging Technology Conference
Conference
Electronics Packaging Technology Conference (EPTC) 2008
DOI
10.1109/EPTC.2008.4763587
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
