2010
Conference Paper
Title

Packaging and assembly for integrated photonics - the ePIXpack photonics packaging service

Abstract
The photonics packaging platform ePIXpack serves the academic community with packaging & assembly developments in the area of integrated photonics. Here we shall review the concept of ePIXpack and some of their recent work.
Author(s)
Zimmermann, L.
Preve, G.B.
Tekin, T.
Rosin, T.
Mainwork
Conference
DOI
Language
English