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Trends in 3D Integration of MEMS and Electronics
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2009
Conference Paper
Title
Trends in 3D Integration of MEMS and Electronics
Author(s)
Wiemer, Maik
Braeuer, J.
Besser, J.
Geßner, Thomas
Mainwork
WaferBond 2009, Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration
Conference
Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration 2009
Language
English
Fraunhofer-Institut für Elektronische Nanosysteme ENAS
