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A multi-test platform to evaluate the barrier properties of electronic encapsulants for advanced medical implants
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2009
Conference Paper
Title
A multi-test platform to evaluate the barrier properties of electronic encapsulants for advanced medical implants
Author(s)
Tathireddy, P.
Jung, E.
Bauer, J.
Schneider, B.
Khan-Malek, C.
Marquardt, K.
Solzbacher, F.
Mainwork
IEEE 59th Electronic Components and Technology Conference, ECTC 2009. Vol.4
Conference
Electronic Components and Technology Conference (ECTC) 2009
DOI
10.1109/ECTC.2009.5074272
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM