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Development of embedded high power electronics modules for automotive applications
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2013
Conference Paper
Title
Development of embedded high power electronics modules for automotive applications
Author(s)
Böttcher, L.
Mainwork
9th International Conference and Exhibition on Device Packaging, DPC 2013
Conference
International Conference and Exhibition on Device Packaging 2013
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
