English
Deutsch
Log In
Log in with Fraunhofer Smartcard
Password Login
Research Outputs
Fundings & Projects
Researchers
Institutes
Statistics
Fraunhofer-Gesellschaft
Home
Fraunhofer-Gesellschaft
Konferenzschrift
Experimental and numerical deformation analysis on components of microsystem technology
Details
Full
Export
Statistics
Options
Show all metadata (technical view)
1994
Conference Paper
Title
Experimental and numerical deformation analysis on components of microsystem technology
Author(s)
Michel, B.
Kühnert, R.
Auersperg, J.
Tränkner, K.
Mainwork
EuPac '94. Vorträge und Posterbeiträge der 1. Europäischen Konferenz für Elektronische Packaging-Technologie und des 7. Internationalen Kolloquiums "Verbindungstechnik in der Elektronik"
Conference
European Conference on Electronic Packaging Technology (EuPac) 1994
International Conference on Interconnection Technology in Electronics 1994
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
