2007
Conference Paper
Title

Vertically coupled GalnAsP/lnP microring lasers fabricated by using full wafer bonding

Abstract
We summarize results on the processing and characterization of current injected 1.55 µm single- and multi-microring lasers including vertical active/passive waveguide coupling. The devices were fabricated by GalnAsP/lnP-GaAs full-wafer bonding using a BCB interface.
Author(s)
Heidrich, H.
Hamacher, M.
Troppenz, U.
Syvridis, D.
Alexandropoulos, D.
Mikroulis, S.
Tee, C.W.
Williams, K.
Dragoi, V.
Alexe, M.
Cristea, D.
Kusko, C.
Kusko, M.
Mainwork
Conference
Language
English
Keyword(s)