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Introduction to Design, Test and Thermal Management of 3D Integrated Circuits
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2019
Book Article
Title
Introduction to Design, Test and Thermal Management of 3D Integrated Circuits
Author(s)
Garrou, Philip
Microelectronics Consultants of NC
Koyanagi, Mitsumasa
Tohoku University
Ramm, Peter
Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT
Mainwork
Handbook of 3D Integration. Design, Test, and Themal Management. Vol.4: Design, Test and Thermal Management of 3D Integrated Circuits
File(s)
Download (130.93 KB)
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Rights
Use according to copyright law
DOI
10.24406/publica-fhg-257077
Language
English
Fraunhofer-Einrichtung für Mikrosysteme und Festkörper-Technologien EMFT
Keyword(s)
3D integration
3DIC
TSV
design
test
thermal management
