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2000
Conference Paper
Title
Lead-Free Solders for Flipchip-Technology
Other Title
Bleifreie Lote für die Flipchip-Technologie
Abstract
A plating concept for the deposition of SnAg (Ag 2.5 - 3.5 wt %) was developed and successfully implemented into a substrate bumping technology. Reliable wetting of Al-Pads (AlSi1 or AlSi1Cu0.5, respectively) on the chips can be achieved by a Ni/Au- finish on the pads. Reliability tests (thermal cycles, humid warmth) were performed with good results.
Conference