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  4. Advanced mask aligner lithography: New illumination system
 
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2010
Journal Article
Title

Advanced mask aligner lithography: New illumination system

Abstract
A new illumination system for mask aligner lithography is presented. The illumination system uses two subsequent microlens-based Köhler integrators. The second Köhler integrator is located in the Fourier plane of the first. The new illumination system uncouples the illumination light from the light source and provides excellent uniformity of the light irradiance and the angular spectrum. Spatial filtering allows to freely shape the angular spectrum to minimize diffraction effects in contact and proximity lithography. Telecentric illumination and ability to precisely control the illumination light allows to introduce resolution enhancement technologies (RET) like customized illumination, optical proximity correction (OPC) and source-mask optimization (SMO) in mask aligner lithography.
Author(s)
Voelkel, R.
Vogler, U.
Bich, A.
Pernet, P.
Weible, K.J.
Hornung, M.
Zoberbier, R.
Cullmann, E.
Stuerzebecher, L.
Harzendorf, T.
Zeitner, U.D.
Journal
Optics Express  
Open Access
DOI
10.1364/OE.18.020968
Additional link
Full text
Language
English
Fraunhofer-Institut für Angewandte Optik und Feinmechanik IOF  
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