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Microelectronics to Nanoelectronics - Reliability and Packaging Considerations
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2006
Conference Paper
Title
Microelectronics to Nanoelectronics - Reliability and Packaging Considerations
Author(s)
Michel, B.
Reichl, H.
Mainwork
Advanced Packaging Conference 2006
Conference
SEMICON Europa 2006
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
