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  4. Rapid prototyping of electronic modules combining aerosol printing and ink jet printing
 
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2010
Conference Paper
Title

Rapid prototyping of electronic modules combining aerosol printing and ink jet printing

Abstract
Maskless direct printing is a good candidate for rapid prototyping and even emerging for manufacturing of large scale electronics. Aiming for rapid prototyping of small multi-layer modules the study combines Aerosol Jet® printing and ink jet printing. Conductive silver traces own to 20 m width were printed together with large mterconnect areas on isolating layers of inorganic-organic hybrid polymer (ORMOCER®) and on glass substrates. New copper nickel inks and high-k ORMOCER®s filled with barium titanate particles are paving a path to integrated printed resistors and capacitors. Although some issues still need to be resolved for a commercial grade process the detail solutions presented for the first time and the active integrated circuits and devices attached to the same substrate demonstrate a path and the principle technical feasibility of this method for heterogeneous integration.
Author(s)
Gieser, H.A.
Bonfert, D.
Hengelmann, H.
Wolf, H.
Bock, K.
Zollmer, V.
Werner, C.
Domann, G.
Bahr, J.
Ndip, I.
Curran, B.
Oehler, F.
Milosiu, H.
Mainwork
3rd Electronics System Integration Technology Conference, ESTC 2010. Proceedings. Vol.2  
Conference
Electronics System Integration Technology Conference (ESTC) 2010  
DOI
10.1109/ESTC.2010.5642953
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
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