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High frequency modeling of the impact of routing coplanar lines on glass substrate with periodic via structures
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2010
Conference Paper
Title
High frequency modeling of the impact of routing coplanar lines on glass substrate with periodic via structures
Author(s)
Erxleben, R.
Ndip, I.
Brusberg, L.
Schroeder, H.
Toepper, M.
Scheel, W.
Guttowski, S.
Reichl, H.
Mainwork
Smart systems integration 2010. 4th European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components. CD-ROM
Conference
European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICs and Electronic Components 2010
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
