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  4. Design aspects of 3D integration of MEMS-based systems
 
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2009
Conference Paper
Title

Design aspects of 3D integration of MEMS-based systems

Abstract
Due to high integration density the influence of manufacturing technologies on the system behavior has to be considered in the design process of 3D systems. Therefore, information from different physical domains has to be provided to designers. The variety of structures and physical effects requires efficient modeling approaches and simulation algorithms. In the following a modular approach which covers detailed analysis with PDE solvers and more abstract behavioral modeling is described.
Author(s)
Schneider, P.
Fraunhofer-Institut für Integrierte Schaltungen IIS  
Reitz, S.
Fraunhofer-Institut für Integrierte Schaltungen IIS  
Stolle, J.
Fraunhofer-Institut für Integrierte Schaltungen IIS  
Martin, R.
Fraunhofer-Institut für Integrierte Schaltungen IIS  
Mainwork
Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2009. CD-ROM  
Conference
Symposium on Design, Test, Integration and Packaging of MEMS, MOEMS (DTIP) 2009  
Conference on CAD, Design and Test 2009  
Conference on Microfabrication, Integration and Packaging 2009  
File(s)
Download (733.45 KB)
Rights
Use according to copyright law
DOI
10.24406/publica-fhg-362168
Language
English
Fraunhofer-Institut für Integrierte Schaltungen IIS  
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