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Characterization of wafer-bonded joins using high-resolution transmission electron microscopy
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2011
Conference Paper
Title
Characterization of wafer-bonded joins using high-resolution transmission electron microscopy
Author(s)
Höche, T.
Graff, A.
Altmann, F.
Petzold, M.
Mainwork
MicroCar 2011. Micro materials, nano materials for automotives. Proceedings
Conference
MicroCar Conference 2011
Language
English
Fraunhofer-Institut für Werkstoffmechanik IWM
