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January 1, 2023
Conference Paper
Title
Integration of LTCC into Printed Circuit Boards for Trustworthy Electronics
Abstract
Sustainable and trustworthy applications gaining significance in electronics, a fast-growing industry itself. The integration of well-established robust materials, like low temperature cofired ceramics (LTCC), into printed circuit boards (PCB) can prolong lifetimes, enhance safety, and improve properties of the assemblies, e.g. RF applications. Thus, new safety elements are designed within the context of the project VE-CeraTrust.
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Conference