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The microDAC deformation analysis - a new method for testing and evaluation of solder interconnect reliability
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2001
Conference Paper
Title
The microDAC deformation analysis - a new method for testing and evaluation of solder interconnect reliability
Author(s)
Michel, B.
Dudek, R.
Vogel, D.
Mainwork
Hart- und Hochtemperaturlöten und Diffusionsschweißen
Conference
Internationales Kolloquium Hart- und Hochtemperaturlöten und Diffusionsschweißen 2001
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
