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Conical dark-field analysis for small grain characterization in narrow Cu interconnect structures: Potential and challenges
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2010
Conference Paper
Title
Conical dark-field analysis for small grain characterization in narrow Cu interconnect structures: Potential and challenges
Author(s)
Hübner, R.
Engelmann, H.-J.
Zschech, E.
Mainwork
Stress-induced phenomena in metallization. Eleventh International Workshop on Stress-Induced Phenomena in Metallization 2010
Conference
International Workshop on Stress-Induced Phenomena in Metallization 2010
DOI
10.1063/1.3527135
Language
English
IZFP-D
