MCM-D with embedded active and passive components

A planar integration technology of bare dice together with passive SMDs embedded in ceramic substrates to yield a high-dense MCM-D is presented. The components are inserted into premanufactured windows of ceramic substrates and fixed in their position. A standard thinfilm multilayer is realized in a planar fashion on top of the embedded system. The metallization is based on a Ti:W / Cu tie layer, which is subsequently electroplated. Cyclotene 4026-46 is used as interlevel dielectric. The embedding technology is verified by an SRAM-MCM thas is comprised of 8 SRAMs and 4 capacitors interconnected by a four layer Cu-metallization.