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Flip chip attachment of fine pitch GaAs devices using ball bumping technology
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1994
Journal Article
Title
Flip chip attachment of fine pitch GaAs devices using ball bumping technology
Author(s)
Eldring, J.
Zakel, E.
Reichl, H.
Journal
International Journal of Microcircuits and Electronic Packaging
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
