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Lead free solders for area array packaging
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2000
Conference Paper
Title
Lead free solders for area array packaging
Author(s)
Klöser, J.
Kallmayer, C.
Jung, E.
Coskina, P.
Aschenbrenner, R.
Reichl, H.
Mainwork
Advanced electronics assembly. A Symposium on Lead Free Interconnect Technology
Conference
Symposium on Lead Free Interconnect Technology 2000
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
