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  4. A comparative study of microstrip, stripline and coplanar lines on different substrate technologies for high-performance applications
 
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2009
Conference Paper
Titel

A comparative study of microstrip, stripline and coplanar lines on different substrate technologies for high-performance applications

Abstract
This paper presents a comparative study of the losses of 4 commonly used planar transmission lines (microstrip, coplanar, grounded coplanar and stripline). The losses are separated into conductor dielectric and radiation losses and investigated on 3 different technologies. These technologies are thin-film polymer substrate, low cost printed circuit board and glass. The attenuation on these 4 lines is computed using quasi-static methods and full wave simulations. The goal is to get an insight on the different frequency-dependent behaviour of the lines to provide the optimal line configuration for a given substrate technology and frequency region.
Author(s)
Erxleben, R.
Ndip, I.
Brusberg, L.
Schröder, H.
Töpper, M.
Scheel, W.
Guttowski, S.
Reichl, H.
Hauptwerk
IMAPS 2009, 42nd International Symposium on Microelectronics
Konferenz
International Symposium on Microelectronics 2009
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Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
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