2001
Conference Paper
Titel

Copper metallization scheme for vertical chip integration
Author(s)
Riedel, S.
Ecke, R.
Schulz, S.E.
Gessner, T.
Wieland, R.
Leutenecker, R.
Klumpp, A.
Ramm, P.
Hauptwerk
Konferenz
Thumbnail Image
Language
English