2016
Conference Paper
Titel

Novel through silicon wiring technology using dry etched sloping vertical terminals
Author(s)
Haas, S.
Voigt, S.
Arnold, M.
Schwenzer, F.
Braunschweig, M.
Küchler, M.
Kurth, S.
Gessner, T.
Hauptwerk
Konferenz
Thumbnail Image
Language
English