In-situ investigation of the interplay between microstructure and anodic copper dissolution under near-ECM conditions. Pt.1: The active state
Abstract
The influence of crystallographic orientation on the anodic dissolution of copper in sodium nitrate under near ECM conditions was investigated in situ by a specially designed electrochemical flow channel cell. The investigation was limited to the active dissolution range where a distinctive influence of the microstructure on the anodic dissolution was expected. It was clearly shown that the topography strongly depends on the crystallographic orientation. The dissolution rate of less-packed {1 0 0} planes is higher than of the close-packed {1 1 1} planes. Additionally, a gas evolution as side reaction was temporarily observed. This process happens preferentially on {1 1 1} planes.
