Wafer Bonding in Micro Mechanics and Microelectronics
The development of electronic and micro-mechanical components has been characterised by a constant increase in the level of integration and the packaging density. Key technologies in the production of electronic components and of wafer-based micro-systems are wafer bonding techniques like anodic bonding, silicon direct bonding, eutectic bonding and seal glass bonding. These technologies are used to assemble prefabricated micro mechanical components like inertial sensors and to fabricate starting materials for electronic components like SOI substrates. The paper gives an overview about the different bonding techniques and their fields of application.