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Simulation for fatigue, cracks and delamination
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2000
Conference Paper
Title
Simulation for fatigue, cracks and delamination
Author(s)
Dudek, R.
Auersperg, J.
Michel, B.
Mainwork
Benefiting from thermal and mechanical simulation in micro-electronics
Conference
International Conference on Benefiting from Thermal and Mechanical Simulation in Micro-Electronics (EuroSimE) 2000
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
