Novel hermetic and low cost glass-capping technology for wafer-level-packaging of optical devices

The novel wafer-level packaging (WLP) process invented allows hermetic capping of optical devices on wafer-level yielding miniaturized glass cavity windows on top of the optical area, at the same time leaving the contact area accessible for standard electrical connections i.e. wire bond. These optical cavity packages are used within standard chip-on-board (COB) assemblies for high performance optical applications providing high yields and utmost reliability for miniaturized optical devices at low costs.