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  4. Computer vision analysis of 3D scanned circuit boards for functional testing and redesign
 
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2013
Journal Article
Title

Computer vision analysis of 3D scanned circuit boards for functional testing and redesign

Abstract
Testing, repair and overhaul of long-living printed circuit boards (PCBs) is a laborious task if no schematics or layout plans are available. Existing Reverse Engineering (RE) methods are time-consuming, error-prone, and destructive and require reference samples which makes them not feasible for non-OEM users of electronic devices. The Fraunhofer Institute for Production Systems and Design Technology (IPK) in Berlin and the Technical University Berlin have defined a new process for automated and non-destructive schematic and layout reconstruction based on electrical and optical measuring techniques. Current results and innovative approaches using computer vision analysis for recognition of PCB structure aiming to build error-free net lists through a net list merging algorithm are depicted in this paper.
Author(s)
Grosser, Hendrik
Beckmann-Dobrev, Boris
Politz, Friedrich
Stark, Rainer
Journal
Procedia CIRP  
Conference
International Through-life Engineering Services Conference (TESConf) 2013  
Open Access
DOI
10.1016/j.procir.2013.07.040
Additional link
Full text
Language
English
Fraunhofer-Institut für Produktionsanlagen und Konstruktionstechnik IPK  
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