High Density Organic Substrates for Chiplet Technologies

The industry’s increasing demand for high-performance electronic devices with better functionality, lower power consumption and higher speed is driving innovation in advanced packaging technology. Improving semiconductor chip performance and advancing package characteristics are critical. These ever-increasing demands on electronic systems have led to the current trend of increasingly relying on so-called chiplets instead of individual chips. In detail, this means that individual silicon building blocks or functional units, which can also be developed and manufactured independently of each other, are combined to form a very powerful overall system. These then find application, for example, in neural networks or advanced driver assistance systems, and generally in all types of AI systems. Since miniaturization of the semiconductor chip is a major challenge, minimizing the wiring length in the package by using denser and thinner interconnects is crucial. The high number of inputs and outputs (I/O) in these high-density packages reduces the structural size of lines and spaces (L/S), and the quality of interconnection of these fine spaces can drastically affect the performance of the device. This paper presents the development of the required building blocks for high-density redistribution layers needed to realize such organic substrates.