SiC-diamond materials: Wear-resistant and versatile

SiC-bonded diamond materials with diamond contents of approximately 50 % by volume can be prepared by pressureless infiltration of diamond shaped bodies with silicon. Graded shaped bodies composed of Si-infiltrated SiC base materials with diamond-SiC composite layers only forming in highly stressed regions can be produced in the same way. This creates the possibility of producing low-cost, wear-resistant components of various geometries and dimensions with bending strengths of more than 400 MPa, hardness values of >48 GPa, and fracture toughness levels of 4, 5-5 MPa-m1/2 for use in extreme loading conditions.