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  4. RFID Sensortransponder mit antiferroelektrischen, eingebetteten Dünnschichtkondensatoren
 
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2023
Conference Paper
Title

RFID Sensortransponder mit antiferroelektrischen, eingebetteten Dünnschichtkondensatoren

Other Title
RFID sensor transponder with antiferroelectric embedded thin film capacitors
Abstract
Miniaturized sensor systems for environmental, building or system monitoring are to record many parameters at the same time and communicate wirelessly. For operation in inaccessible locations, they must also be maintenance-free and have a self-sufficient, battery-free power supply. Storage capacitors are an essential element in the energy management of such sensor systems. Fraunhofer IPMS has been developing high-capacity silicon capacitors for several years, which are particularly well suited for embedding in chip housings due to their low structural height of 50 μm. Passive UHF transponders with various sensors serve as an application example. All of the energy required operating the circuit and sensors obtained from the electromagnetic field of a read/write device and stored in a silicon capacitor integrated in the transponder chip. Experimental setups carried out with chip-on-board assembly and in multi-chip packages.
Author(s)
Heinig, Andreas  
Fraunhofer-Institut für Photonische Mikrosysteme IPMS  
Viegas, Alison Erlene
Fraunhofer-Institut für Photonische Mikrosysteme IPMS  
Weder, Andreas  
Fraunhofer-Institut für Photonische Mikrosysteme IPMS  
Czernohorsky, Malte  
Fraunhofer-Institut für Photonische Mikrosysteme IPMS  
Mainwork
MikroSystemTechnik Kongress 2023  
Funder
Bundesministerium für Bildung und Forschung  
Conference
MikroSystemTechnik Kongress 2023  
Language
German
Fraunhofer-Institut für Photonische Mikrosysteme IPMS  
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