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1985
Conference Paper
Title
Zerstörungsfreie Prüfung von Fügestellen an keramischen Werkstoffen und Bauteilen
Abstract
The use of different materials in a component requires special bonding technigues. The tolerable defect size is smaller for brittle ceramic materials than for metals in which mechanical stress around defects is reduced by plastic deformation. In this paper we discuss ultrasonic and X-ray methods for the non-destructive evaluation of bonds within components made out of ceramic materials.