Development of the Laser Beam Based High-Current Contacting Technology and an Integrated Lead Frame Stack Structure

High-performance switching elements in power electronics are a decisive element for the performance of converters and control elements in E-mobility and renewable energy systems. The packaging and interconnection technology requires a high current carrying capacity with efficient thermal management to ensure long-term stability and high performance. In this paper, a new development of laser beam based high-current contacting technology and an integrated lead frame stack structure for efficient heat dissipation is investigated. The purpose of this development is to increase the power and integration density of power semiconductor devices while simultaneously improving the switching properties in high frequency switching processes.