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  4. Speckle photographic strain field measurement. A helpful aid in fracture modelling and analysis of microstructures
 
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1994
Conference Paper
Title

Speckle photographic strain field measurement. A helpful aid in fracture modelling and analysis of microstructures

Abstract
By means of speckle photography displacements and strains of fracture specimen are measured methods of digital image processing are applied. The strain field of a CT specimen is measured in a small region around the cracktip. The method was also applied to an unnotched Al2O3 ceramic specimen.
Author(s)
Vogel, D.
Sommer, J.-P.
Michel, B.
Mainwork
Structural Integrity - Experiments, Models, Applications. Proceedings of the 10th Biennial European Conference on Fracture  
Conference
European Conference on Fracture (ECF) 1994  
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Keyword(s)
  • experimental mechanics

  • fracture mechanics

  • image processing

  • laser metrology

  • micromechanics

  • speckle photography

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