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  4. Analysis of lateral DMOS power devices under ESD stress conditions
 
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2000
Journal Article
Title

Analysis of lateral DMOS power devices under ESD stress conditions

Abstract
The physical mechanisms specific for 40 V LDMOS power transistors under ESD stress (gate grounded/coupled) are investigated in detail by transmission line pulse (TLP) measurements, human body model (HBM) testing, emission microscopy (EMMI) experiments, and two-dimensional (2-D) device simulations. Inhomogeneous triggering caused by device topology as well as the sustained nonhomogeneous current flow due to the unusual electrical behavior are accurately analyzed in single- and multi-finger devices
Author(s)
Mergens, M.P.J.
Wilkening, W.
Mettler, S.
Wolf, H.
Stricker, A.
Fichtner, W.
Journal
IEEE transactions on electron devices  
DOI
10.1109/16.877175
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
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