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  4. Calibrating a fiber-matrix interface failure model to single fiber push-out tests and numerical simulations
 
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2021
Journal Article
Title

Calibrating a fiber-matrix interface failure model to single fiber push-out tests and numerical simulations

Abstract
To characterize the fiber matrix interface of a glass-fiber reinforced sheet molding compound (SMC), single fiber push-out tests are performed and simulated numerically. The parameters of a cohesive zone model for the interface are calibrated on the single-fiber push-out tests. The fracture-toughness/energy release rate therein is determined from cyclic (loading unloading) experiments. The matrix model, consisting of the nonlinear-elastic Neo-Hooke law with a Prony series to model viscoelastic behavior, is calibrated with data from nanoindentation tests by adjusting simulation curves to their experimental counterparts. Using the calibrated model of the single-fiber push-out, the influence of neighboring fibers and thermally induced residual stresses is shown. The interface damage initiates in the single-fiber push-out test at the indented fiber at positions closest to other fibers under the surface. In addition this is the position where the radially largest fiber expansion due to the Poisson effect is found. The results reveal that although the push-out test is simple to perform, the interpretation of its results might be a complicated task.
Author(s)
Rohrmüller, B.
Institute for Applied Materials, Karlsruhe Institute of Technology (KIT); Fraunhofer-Institut für Werkstoffmechanik IWM
Gumbsch, P.
Institute for Applied Materials, Karlsruhe Institute of Technology (KIT); Fraunhofer-Institut für Werkstoffmechanik IWM
Hohe, J.
Fraunhofer-Institut für Werkstoffmechanik IWM  
Journal
Composites. Part A, Applied science and manufacturing  
Funder
Deutsche Forschungsgemeinschaft DFG  
Open Access
DOI
10.1016/j.compositesa.2021.106607
Language
English
Fraunhofer-Institut für Werkstoffmechanik IWM  
Keyword(s)
  • polymer-matrix composites

  • interface

  • cohesive interface modeling

  • microstructural analysis

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