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Improved long-term stability of solder joints through rapid reflowing
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2002
Conference Paper
Title
Improved long-term stability of solder joints through rapid reflowing
Author(s)
Herbert, F.
Dorn, L.
Mainwork
Design, Test, Integration, and Packaging of MEMS/MOEMS 2002
Conference
Design, Test, Integration, and Packaging of MEMS/MOEMS 2002
Language
English
Fraunhofer-Institut für Produktionsanlagen und Konstruktionstechnik IPK