Precision photonic packaging using laser-based solderjet bumping

Laser-based Solderjet Bumping is a fast, precise and versatile technique for flux-free soldering of hybrid photonic systems and features a high potential for automation. Liquid solder droplets are jetted to the wetting surfaces of 3D joining geometries. A direct coupling high power fibre assembly with an adjusted multi-mode step-index fibre in front of an IR-laser diode is shown. The fibre is fixated within a solder droplet with a verticle gap of up to 50 µm and placement accuracy of 3 µm.