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Deformation measurements at components, printed wiring boards and microelectronic assemblies to ensure the reliability of a system
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1996
Conference Paper
Title
Deformation measurements at components, printed wiring boards and microelectronic assemblies to ensure the reliability of a system
Author(s)
Ahrens, T.
Krumm, M.
Mainwork
EuPac '96. Lectures and Posters show contributions of the 2nd European Conference on Electronic Packaging Technology & 8th International Conference on Interconnection Technology in Electronics
Conference
International Conference on Interconnection Technology in Electronics 1996
European Conference on Electronic Packaging Technology (EuPac) 1996
Language
English
Fraunhofer-Institut für Siliziumtechnologie ISIT
