Dionysys - Design technology for radio frequency systems in package

System in package facilitates the integration of systems with high complexity. Inside the package different dies can be stacked or mounted on a substrate. The combination of different technologies is attractive for the integration of RF, mixed-signal or sensor applications. Especially for RF applications, the current design methodology does not support IC and package co-design with the desired efficiency, especially for RF applications. The article gives an outline of the research project Dionysys that was initiated to improve the design flow for RF SiP.