November 23, 2022
Presentation
Title

Ceramic Embedding as Packaging Solution for Future WBG Power Devices

Title Supplement
Presentation held at the ECPE Hybrid Workshop "Embedding and Advanced Integration Technologies in Power Electronics", 23rd November 2022
Author(s)
Bach, Hoang Linh  
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB  
Conference
Open Access
File(s)
Rights
CC BY-ND 4.0: Creative Commons Attribution-NoDerivatives
DOI
Language
English
Keyword(s)