Advancing Packaging Solutions: Integrating Power Electronics Using LTCC Technology

The rapid advancement in system integration has led to a significant reduction in the size of electronic components. Nevertheless, microelectronic packaging is still seen as a challenge, especially for applications requiring stability at high operating frequencies, e.g., power electronics. Additionally, downsizing of passive elements, such as inductors while maintaining a stable performance remains tempting. Low-temperature co-fired ceramics (LTCC) technology offers a solution by enabling the miniaturization of complex electronic assemblies with high integration density. In this context, we explore the feasibility of integrating ferrite inductors into LTCC modules. Tailored Nickel Copper Zinc (NCZ) Ferrite is employed to screen-print planar coils as integrated functional units within LTCC, as well as their co-firing with LTCC is optimized. Results provide the standard magnetic properties evaluation and give the prospect of transmitting the merits of LTCC technology to advanced packaging solutions.