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2019
Conference Paper
Title
Machining Grooves in Silica Glass by Using Picosecond Lasers
Abstract
A picosecond laser with 1064nm wavelength was used to machine grooves in fused silica in this paper. A surface texturing method was applied to increase the laser absorption. The relationship between the width, the depth of the groove and the laser parameters such as laser power, scanning speed, number of scanning cycles was studied. The machining quality of the groove was detected by the laser scanning confocal microscopy. It showed that there were no micro-cracks on the grooving surface, and the surface roughness Ra<1.6um. The width, the depth and the shape of the groove could be controlled accurately by changing the laser parameters. And, a "V-shape" groove with 1mm width, 1mm depth was obtained with the as the frequency, the laser power, the scanning velocity and the number scanning cycle was fixed at 400KHz, 141W, 5000mm/s and 12, respectivity.