Two lithography-based technologies for the fabrication of submicron to deep-submicron structures

It is investigated the submicron fabrication feasibility of lithography technology. Two methods that can produce regular deep submicron structures in batch are demonstrated. In the first one, closed metal tubes of less than 100nm wall thickness are produced by sputter coating on solid patterns of 500 nm diameter and 1 micron height. In the second technology, free-standing metal tubes of about 200 nm wall thickness are produced by selective deposition on the sidewalls of pre-deposited hollow voids, and subsequent dissolving of the shape-forming sacrifice material. A comparison of these two methods will be made, and possible applications of these structures are illustrated.