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  4. Packaging and characterisation of ultra low power VCSEL for sensor networks
 
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2011
Conference Paper
Title

Packaging and characterisation of ultra low power VCSEL for sensor networks

Abstract
In this paper an ultra-low power VCSEL with an electrical consumption of below 5 mW is characterised to electrical power, optical power, temperature as well as a spectral investigation. First the pigtail manufacture is described, where amongst others the VCSEL is bonded on a ceramic carrier and connected to an optical fibre by front surface coupling. Thereby the fibre-chip coupling is realised by using index matching adhesive as well as active alignment. Finally the results of the characterisation are analysed to find optimal operation conditions. For comparison results of a common VCSEL are shown.
Author(s)
Sohr, S.
Fischer, D.
Rieske, R.
Nieweglowski, K.
Wolter, K.-J.
Mainwork
2011 International Students and Young Scientists Workshop "Photonics and Microsystems", STYSW 2011  
Conference
International Students and Young Scientists Workshop "Photonics and Microsystems" (STYSW) 2011  
DOI
10.1109/STYSW.2011.6155858
Language
English
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