Highest Throughput Laser Processing for Thin Plated Contacts

The market for solar cells and modules is growing rapidly, but it also poses significant challenges to existing production technologies, including laser processing tools. In this paper, we present our approach for the next generation of laser processing and demonstrate its capabilities for the demanding application of laser contact opening. Our concept is based on on-the-fly processing employing an ultrafast polygon scanner combined with a high repetition rate laser and high-end lens. The on-the-fly process consists of a linear axis transport system synchronized with the scanner, allowing for operation within a quasi 1D scanning field, which enhances the homogeneity of the laser contact openings and the number of elements processed in a time period. The scanning system could achieve a potential throughput of 31,500 M10 (182 mm x 182 mm) wafers on a single lane, with small structures (< 10 μm) at record speeds.