3D wire - a novel approach for 3D chips interconnection for harsh environment applications

MEMS sensor packaging is one of the key technologies in MEMS technology development, since it is a key step to turn MEMS product from research to application. Compared to the current technology used in MEMS device or system design and production, relatively backward packaging technology has become a bottleneck restricting the possibility for new MEMS products to enter the market. In order to achieve mass production of MEMS devices and to reduce the production cost of new MEMS products, design, process and reliability of the package must be taken into consideration at the early stage of the development. MEMS packaging technology is becoming equally important as the MEMS sensor itself. Therefore, research and development of low-cost, high-performance and high-density packaging technology have turned into an important issue in the field of MEMS. In this paper we discuss a new integration concept, using a novel plasma-based additive technology to reduce the fabrication cost and to realize an easy process flow. This study also demonstrates the capability for deposit interconnection layer in a high temperature piezoresistive sensor housing systems.